Method for transferring a useful layer into a supporting substrate
US11401162B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2018 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Jul 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/8542
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A process for transferring a useful layer to a carrier substrate including a first surface is provided, the process including the steps of: providing a donor substrate including a first surface, a weakened zone including implanted species, the useful layer, which is bounded by the weakened zone and by the first surface of the donor substrate, and an amorphous zone disposed, in the useful layer, parallel to the weakened zone; assembling, on a side of the first surface of the donor substrate and on a side of the first surface of the carrier substrate, the donor substrate with the carrier substrate by bonding, such that the amorphous zone is at least partially facing at least one cavity that is partially bounded by the first surface of the donor substrate; and splitting the donor substrate along the weakened zone so as to reveal the useful layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.