Heat dissipation device and fin structure
US11402163B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 14, 2019 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Dec 23, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F3/027
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
This disclosure relates to a fin structure including a main body and at least one minor structure. The main body includes a main plate and two side plates. The main plate has at least one through hole. The two side plates are respectively connected to two opposite sides of the main plate and protrude from the main plate. The at least one minor structure protrudes from the main plate and is located at a side of the main plate. The at least one minor structure is spaced apart from the two side plates. The at least one minor structure partially covers the at least one through hole. The at least one minor structure has a length, in a longitudinal direction of the main plate, less than a length of the at least one through hole of the main plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.