Chia-Yu Lin
35Patents
2h-index
59Co-inventors
56Inventor score
Filing activity: Dec 16, 2008 → Jul 5, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10436254B1 | Linear guideway capable of detecting abnormal circulation state | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US8853919B2 | Ultrasonic sensor device | Physics | 3 | Active |
| US10557504B1 | Linear guideway capable of detecting abnormal circulation state | Mechanical Engineering; Lighting; Heating | 2 | Active |
| US10826473B2 | PVT-independent fixed delay circuit | Electricity | 1 | Active |
| US9431271B2 | Heat dissipating device | Electricity | 1 | Active |
| US9347712B2 | Heat dissipating device | Electricity | 1 | Active |
| US11402163B2 | Heat dissipation device and fin structure | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US10508691B1 | Linear guideway | Electricity | 1 | Active |
| US11655138B2 | Roughness selectivity for MEMS movement stiction reduction | Performing Operations; Transporting | 0 | Active |
| US11732981B2 | Heat dissipation device | Physics | 0 | Active |
| US11742320B2 | Wafer bonding alignment | Electricity | 0 | Active |
| US11692777B2 | Heat exchanger fin and manufacturing method of the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US11099838B1 | Method and system for recovery for custom integrated circuit | Physics | 0 | Active |
| US12118091B2 | Methods for securely updating software | Physics | 0 | Active |
| US12283568B2 | Wafer bonding alignment | Electricity | 0 | Active |
| US11713273B2 | Glass material with low dielectric constant and low fiberizing temperature | Chemistry; Metallurgy | 0 | Active |
| US11530879B2 | Heat exchanger fin and manufacturing method of tHE same | Emerging Cross-Sectional Technologies | 0 | Active |
| US8919423B2 | Heat dissipating device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11828754B2 | Modified electrode, manufacturing method thereof and use thereof | Physics | 0 | Active |
| US10083529B2 | Reduction method for boundary artifact on the tomosynthesis | Physics | 0 | Active |
| US11725885B2 | Heat exchanger fin and manufacturing method of the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US12054382B2 | Roughness selectivity for MEMS movement stiction reduction | Performing Operations; Transporting | 0 | Active |
| US10349558B2 | Method of manufacturing heat dissipating device | Electricity | 0 | Active |
| US12163745B2 | Heat dissipation device and fin structure | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US11384999B2 | Heat dissipation device | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.