Multi-layer embedded magnetic inductor coil
US11404364B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2018 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Nov 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronics package comprises a substrate that comprises a dielectric and at least two conductor layers within the dielectric, and an inductor structure having a magnetic core at least partially within the dielectric and extending at least between a first conductor layer and a second conductor layer. The inductor structure comprises at least one conductor that extends horizontally at least partially within the magnetic core. The conductor extends in the z-direction within the magnetic core between the first conductor layer and the second conductor layer. One or more vias extend within the dielectric adjacent to the magnetic core between the first conductor layer and the second conductor layer. The conductor of the inductor has a length extending through the magnetic core that is greater than a width of the conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.