Wideband termination for high power applications
US11406008B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Aug 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.