Apparatus for processing substrate including cooling member closer to central axis than heating member
US11410862B2 · kind B2 · utility
1Cited by
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8Claims
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Key dates
| Filing date | Apr 28, 2019 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Feb 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a substrate includes a chamber having a processing space inside, a substrate support unit that supports the substrate in the processing space, and a temperature adjustment unit that is installed in the chamber and that adjusts temperature in the processing space. The temperature adjustment unit includes a heating member that heats the processing space and a cooling member that cools the processing space. The cooling member is located closer to a central axis of the chamber than the heating member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.