Die attach systems, and methods of attaching a die to a substrate
US11410870B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jun 21, 2021 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jun 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.