Semiconductor package device and method of manufacturing the same
US11410899B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
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Key dates
| Filing date | Jan 23, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Mar 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.