Patent · US Active

Brass-coated metals in flip-chip redistribution layers

US11410947B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Vivek Swaminathan Sridharan · Dallas, US
Christopher Daniel Manack · Flower Mound, US
Nazila Dadvand · Montréal, CA
Salvatore Frank Pavone · Sachse, US
Patrick Francis Thompson · Allen, US

Key dates

Filing date	Dec 19, 2019
Grant date	Aug 9, 2022
Priority date	—
Expiry date	Dec 21, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0132
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package comprises a die and a redistribution layer coupled to the die. The redistribution layer comprises a metal layer, a brass layer abutting the metal layer, and a polymer layer abutting the brass layer. The package is a wafer chip scale package (WCSP). The package further includes a solder ball attached to the redistribution layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.