Bonding apparatus
US11410960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2018 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Jun 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding apparatus includes a bonding stage on which either a rectangular substrate or a circular substrate can be installed; a first transport mechanism which transports the rectangular substrate from a first carry-in unit to the bonding stage and from the bonding stage to a first carry-out unit; and a second transport mechanism which transports the circular substrate from a second carry-in/out unit to the bonding stage and from the bonding stage to the second carry-in/out unit, in which a first transport path determined by the first transport mechanism and a second transport path determined by the second transport mechanism partially overlap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.