Apparatus and method for chemically mechanically polishing
US11413722B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2020 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Jun 15, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49815
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for chemically mechanically polishing includes an arm configured to move a conditioner module. The conditioner module is configured to contact a pad so as to change a degree of roughness of the pad. The pad is configured to contact and polish a semiconductor wafer. The arm has a first end and a second end opposite to the first end. The first end has an electromagnetic module. The conditioner module is detachably magnetically coupled to the arm by means of the electromagnetic module. The second end is coupled to a knob and configured to pivot at the knob. The arm moves the conditioner module through the pivoting of the second end at the knob. The conditioner module is disconnected from the arm when a magnetic polarity at the electromagnetic module is changed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.