Negative type photosensitive resin composition, photosensitive resist film, pattern forming method, cured film, and method of producing cured film
US11415888B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2017 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Jul 12, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A negative type photosensitive resin composition containing an epoxy group-containing resin; a metal oxide; and a cationic polymerization initiator (I). The cationic polymerization initiator (I) contains one or more of a compound represented by Formula (I1) and a compound represented by Formula (I2). In Formula (I1), Rb01 to Rb04 represent an aryl group which may have a substituent or a fluorine atom. In Formula (I2), Rb05 represents a fluorinated alkyl group which may have a substituent or a fluorine atom. A plurality of Rb05's may be the same as or different from one another. q represents an integer of 1 or greater, and Qq+'s each independently represent a q-valent organic cation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.