Self-measurement of semiconductor image using deep learning
US11416977B2 · kind B2 · utility
4Cited by
2References
21Claims
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Key dates
| Filing date | Mar 10, 2020 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | May 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and non-transitory computer readable medium are described for automated image measurement for process development and optimization. An example method may include receiving an image of a product associated with a manufacturing process, wherein the product comprises a plurality of structures; identifying, using a trained machine learning model, a segment of the image that comprises a structure of the plurality of structures; determining a plurality of image measurements of the segment that comprises the structure; and storing the plurality of image measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.