Methods to embed magnetic material as first layer on coreless substrates and corresponding structures

US11417614B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Cheng Xu · Chandler, US
• Kyu Oh Lee · Chandler, US
• Junnan Zhao · Gilbert, US
• Rahul Jain · Chandler, US
• Ji-Yong Park · Seoul, KR
• Sai Vadlamani · Chandler, US
• Seo Young Kim · Seoul, KR

Key dates

• Filing date: Mar 28, 2018
• Grant date: Aug 16, 2022
• Expiry date: Nov 23, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.