Flip-chip device
US11417622B2 · kind B2 · utility
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30Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 15, 2020 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Oct 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are devices, fabrication methods and design rules for flip-chip devices. Aspects include an apparatus including a flip-chip device. The flip-chip device including a die having a plurality of under bump metallizations (UBMs). A package substrate having a plurality of bond pads is also included. A plurality of solder joints coupling the die to the package substrate. The plurality of solder joints are formed from a plurality of solder bumps plated on the plurality of UBMs, where the plurality of solder bumps are directly connected to the plurality of bond pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.