Inventor · Gilbert, AZ, US

Dongming He

17Patents
5h-index
28Co-inventors
66Inventor score

Filing activity: May 8, 2001 → Jan 12, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US8963339B2 Stacked multi-chip integrated circuit package Electricity 55 Active
US7251389B2 Embedded on-die laser source and optical interconnect Physics 38 Expired
US6573734B2 Integrated thin film liquid conductivity sensor Physics 17 Expired
US6989586B2 Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems Emerging Cross-Sectional Technologies 16 Expired
US7517787B2 C4 joint reliability Electricity 5 Expired
US9406649B2 Stacked multi-chip integrated circuit package Electricity 3 Active
US7465651B2 Integrated circuit packages with reduced stress on die and associated methods Emerging Cross-Sectional Technologies 1 Expired
US7626251B2 Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same Electricity 1 Active
US11437335B2 Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods Electricity 0 Active
US11694982B2 Sidewall wetting barrier for conductive pillars Electricity 0 Active
US11948909B2 Package comprising spacers between integrated devices Electricity 0 Active
US9607777B2 Separator and electrochemical device Emerging Cross-Sectional Technologies 0 Active
US11417622B2 Flip-chip device Electricity 0 Active
US11557557B2 Flip-chip flexible under bump metallization size Electricity 0 Active
US7656035B2 C4 joint reliability Electricity 0 Active
US12113038B2 Thermal compression flip chip bump for high performance and fine pitch Electricity 0 Active
US11721656B2 Integrated device comprising pillar interconnect with cavity Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.