Semiconductor wafer of monocrystalline silicon and method of producing the semiconductor wafer

US11417733B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Andreas Sattler · Trostberg, DE
• Alexander Vollkopf · Burghausen, DE
• Karl Mangelberger · Ach, AT

Key dates

• Filing date: Jul 19, 2018
• Grant date: Aug 16, 2022
• Expiry date: Jun 17, 2039

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Epitaxially coated semiconductor wafers of monocrystalline silicon comprise a p+-doped substrate wafer and a p-doped epitaxial layer of monocrystalline silicon which covers an upper side face of the substrate wafer;