Micromechanical component for a sensor device or microphone device

US11418885B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Heribert Weber · Leverkusen, DE
• Andreas Scheurle · Leonberg, DE
• Christoph Hermes · Kirchentellinsfurt, DE
• Peter Schmollngruber · Aidlingen, DE
• Thomas Friedrich · Bietigheim-Bissingen, DE

Key dates

• Filing date: Jan 12, 2021
• Grant date: Aug 16, 2022
• Expiry date: Mar 11, 2041

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/0257
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.