Andreas Scheurle
11Patents
1h-index
29Co-inventors
50Inventor score
Filing activity: Oct 20, 2008 → Sep 3, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8329555B2 | Method for producing a capping wafer for a sensor | Electricity | 3 | Active |
| US10018650B2 | Rocker device for a micromechanical Z sensor | Physics | 0 | Active |
| US12365581B2 | Micromechanical component for a sensor or microphone device | Performing Operations; Transporting | 0 | Active |
| US9970957B2 | Rocker device for a micromechanical Z-sensor | Physics | 0 | Active |
| US11418885B2 | Micromechanical component for a sensor device or microphone device | Performing Operations; Transporting | 0 | Active |
| US8928099B2 | Micromechanical component and method for the manufacture of same | Performing Operations; Transporting | 0 | Active |
| US10336610B2 | Method for producing a micromechanical component | Performing Operations; Transporting | 0 | Active |
| US9309107B2 | Micromechanical system and corresponding manufacturing method | Emerging Cross-Sectional Technologies | 0 | Active |
| US12151936B2 | Micromechanical component for a sensor device or microphone device | Electricity | 0 | Active |
| US11407635B2 | Bonding pad layer system, gas sensor and method for manufacturing a gas sensor | Electricity | 0 | Active |
| US11905166B2 | Production method for a micromechanical component | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.