Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same
US11421073B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Oct 1, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Oct 1, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2019/323
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A highly thermally conductive epoxy compound, and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package, each including the highly thermally conductive epoxy compound. The epoxy compound is represented by Chemical Formula 1 below and has at least one mesogenic naphthalene unit. E1-M1-L1-M2-L2-M3-E2 Chemical Formula 1In Chemical Formula 1, at least one of M1, M2, or M3, which are mesogenic units, is a naphthalene unit. M1, M2, M3, L1, L2, and E1 and E2 are as defined in the detailed description.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.