Mooho Lee
7Patents
1h-index
19Co-inventors
40Inventor score
Filing activity: Apr 7, 2015 → Sep 27, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11421073B2 | Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same | Chemistry; Metallurgy | 1 | Active |
| US9381498B2 | Method for preparing hydrogenation catalyst and method for preparing diols from lactones using the hydrogenation catalyst | Chemistry; Metallurgy | 1 | Active |
| US10160857B2 | Thermoplastic resin composition and molded article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US11926695B2 | High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same | Electricity | 0 | Active |
| US10160825B2 | Polyurethane elastomer, thermoplastic resin composition comprising the polyurethane elastomer, molded article made of the thermoplastic resin composition, and method of preparing the polyurethane elastomer | Chemistry; Metallurgy | 0 | Active |
| US12404361B2 | Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same | Electricity | 0 | Active |
| US10479889B2 | Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.