Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board
US11421107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2018 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Jan 13, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C. for 100 hours having an adhesive force to polyimide of at least 0.8 times the initial adhesive force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.