Sputtering target and method of producing sputtering target
US11421315B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2019 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Jan 20, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
[Object] To provide a sputtering target with further improved sputtering efficiency, and a method of producing the sputtering target.[Solving Means] In order to achieve the above-mentioned object, a sputtering target according to an embodiment of the present invention is a cobalt target having a sputtering surface and a purity of 99.95 wt % or more. An intensity ratio (I(002)+I(004))/(I(100)+I(002)+I(101)+I(102)+I(110)+I(103)+I(112)+I(004)) of X-ray diffraction peaks corresponding to a (100) plane, a (002) plane, a (101) plane, a (102) plane, a (110) plane, a (103) plane, a (112) plane, and a (004) plane of a hexagonal close-packed lattice structure along the sputtering surface is 0.85 or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.