Exposed wire-bonding for sensing liquid and water in electronic devices
US11422104B2 · kind B2 · utility
1Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Jul 29, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/0362
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor affixed to a die disposed in the sensor volume, and an exposed moisture detection conductor positioned in the sensor volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.