Caleb C. Han
8Patents
2h-index
17Co-inventors
40Inventor score
Filing activity: Feb 4, 2013 → Feb 3, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9661411B1 | Integrated MEMS microphone and vibration sensor | Electricity | 28 | Active |
| US11561144B1 | Wearable electronic device with fluid-based pressure sensing | Physics | 7 | Active |
| US9574959B2 | Various stress free sensor packages using wafer level supporting die and air gap technique | Electricity | 2 | Active |
| US11422104B2 | Exposed wire-bonding for sensing liquid and water in electronic devices | Physics | 1 | Active |
| US10041847B2 | Various stress free sensor packages using wafer level supporting die and air gap technique | Electricity | 1 | Active |
| US12251204B2 | Blood pressure monitoring system including a liquid filled sensor | Human Necessities | 0 | Active |
| US8710636B1 | Lead frame array package with flip chip die attach | Electricity | 0 | Active |
| US8969139B2 | Lead frame array package with flip chip die attach | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.