Predetermining separate thermal control points for chips of a multi-chip module
US11422597B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2021 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Jan 9, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.