Sputtering target assembly to prevent overetch of backing plate and methods of using the same
US11424111B2 · kind B2 · utility
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3References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 25, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Jun 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3447
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.