Photopatterned planarization layers for flexible electronics
US11427684B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jun 20, 2018 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Feb 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6755
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.