Wafer inspection device and method of manufacturing semiconductor device by using the wafer inspection device
US11428645B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 21, 2020 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Jan 20, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/213
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to embodiments, a wafer inspection device is provided. The wafer inspection device includes a porous chuck including a plurality of pores formed all over the porous chuck to allow pressure for fixing a wafer to be applied thereto, a chuck driving device, a back side inspection optical system configured to inspect a portion of a back surface of the wafer, and a position identification optical system, wherein the porous chuck includes a plurality of holes uniformly formed all over the porous chuck to partially expose the back surface of the wafer and a slit exposing the back surface of the wafer and extending in one direction parallel to a top surface of the porous chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.