Methods of estimating warpage of interposers and methods of manufacturing semiconductor package by using the same
US11429777B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2021 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Mar 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of estimating warpage of an interposer and a method of manufacturing a semiconductor package by using the same are disclosed. The interposer includes a through electrode passing through a substrate, and a plurality of metal wiring layers and a plurality of insulating layers on the substrate, and the method of estimating warpage of an interposer includes: performing a temperature sweep test by using sample interposers, and measuring warpages according to temperatures; deriving a warpage slope, as a function of temperature, of each of the sample interposers; deriving a warpage model by linearly fitting the warpage slope with respect to an average pattern density of metal wiring layers in each of the sample interposers; and calculating a room temperature warpage reference value of the interposer based on the warpage model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.