Yunki Choi
3Patents
0h-index
10Co-inventors
25Inventor score
Filing activity: Mar 26, 2021 → Jan 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12159095B2 | Method of designing interconnect structure of semiconductor apparatus and method of manufacturing semiconductor apparatus using the same | Electricity | 0 | Active |
| US12107034B2 | Semiconductor chip and semiconductor package including same | Electricity | 0 | Active |
| US11429777B2 | Methods of estimating warpage of interposers and methods of manufacturing semiconductor package by using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.