Substrate processing apparatus and substrate processing method
US11430673B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2021 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Apr 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A substrate processing apparatus includes at least one nozzle unit configured to eject a processing liquid to a substrate. The at least one nozzle unit includes a conductive part for voltage application configured to be brought into contact with the processing liquid, and a voltage detection part or a current detection part configured to be brought into contact with the processing liquid. A non-conductive part is interposed between the conductive part for voltage application and the voltage detection part or between the conductive part for voltage application and the current detection part. A voltage application part is connected to the conductive part for voltage application, and a voltage detector is installed in the voltage detection part or a current detector is installed in the current detection part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.