Lead frames for semiconductor packages with increased reliability and related semiconductor device packages and methods
US11430718B2 · kind B2 · utility
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3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 2021 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | May 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Lead frames for semiconductor device packages may include lead fingers proximate to a die-attach pad. A convex corner of the die-attach pad, or of the lead fingers proximate to a geometric center of the lead frame may be rounded to exhibit a radius of curvature of at least two times a greatest thickness of the die-attach pad, the thickness measured in a direction perpendicular to a major surface of the die-attach pad. A shortest distance between the die-attach pad and a largest of the lead fingers may be at least two times the greatest thickness of the die-attach pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.