Behrooz Mehr
11Patents
6h-index
12Co-inventors
63Inventor score
Filing activity: Mar 22, 1994 → Aug 12, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5530295A | Drop-in heat sink | Emerging Cross-Sectional Technologies | 38 | Expired |
| US5936848A | Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5489805A | Slotted thermal dissipater for a semiconductor package | Electricity | 24 | Expired |
| US5444909A | Method of making a drop-in heat sink | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6133134A | Ball grid array integrated circuit package | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7505248B2 | Controlled-resistance capacitors, and methods of assembling same | Electricity | 8 | Expired |
| US11430718B2 | Lead frames for semiconductor packages with increased reliability and related semiconductor device packages and methods | Electricity | 0 | Active |
| US11769713B2 | Lead frames having rounded corners and related packages and methods | Electricity | 0 | Active |
| US6924970B2 | Capacitor method and apparatus | Electricity | 0 | Expired |
| US11476208B2 | Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods | Electricity | 0 | Active |
| US10741507B2 | Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.