ESD protection in an electronic device
US11430749B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2019 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | May 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/911
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one configuration, a fabricator produces an electronic device to include: a substrate; a transistor circuit disposed on the substrate; silicide material disposed on first regions of the transistor circuit; and the silicide material absent from second regions of the transistor circuit. Absence of the silicide material over the second regions of the respective of the transistor circuit increases a resistance of one or more parasitic paths (such as one or more parasitic transistors) in the transistor circuit. The increased resistance in the one or more parasitic paths provides better protection of the transistor circuit against electro-static discharge conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.