Semiconductor device with exposed input/output pad in recess
US11430775B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2019 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Jan 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/9202
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a semiconductor structure and an input/output pad. The semiconductor structure includes a first substrate and a conductive layer, in which the first substrate has a first surface and a second surface opposite to each other, the conductive layer is disposed on the first surface of the first substrate, and the conductive layer includes one or more first trace. The first semiconductor structure has a recess penetrating the first substrate and exposing the one or more first trace, and the input/output pad is disposed on the one or more first trace and in the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.