Resin composition and article made therefrom
US11434366B2 · kind B2 · utility
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10Claims
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Assignee
Inventor
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Oct 6, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes a vinyl group-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination ionic compound, wherein the magnesium and aluminum combination ionic compound has a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.