Pattern edge detection method
US11436736B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2019 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Aug 8, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a pattern edge detection method applicable to a semiconductor inspection apparatus that performs a pattern inspection using pattern design data. This method includes: generating an image of a pattern; detecting an edge of the pattern on the image based on a reference pattern generated from design data for the pattern; repeating generating of an image of a pattern and detecting of an edge of the pattern on the image to produce training-data candidates including a plurality of images and corresponding pattern edges; determining training data by removing pattern edges and corresponding images from the training-data candidates, the pattern edges to be removed being pattern edges satisfying a predetermined disqualification condition; producing an edge detection model by machine learning using the training data; generating an image of other pattern; and detecting an edge of the other pattern on the image using the edge detection model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.