Surface mount device placement to control a signal path in a printed circuit board
US11439015B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2019 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Jul 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and coupling, via a discrete SMD, the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.