Alternative compositions for high temperature soldering applications
US11440142B2 · kind B2 · utility
0Cited by
14References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 16, 2014 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Jun 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8384
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.