Cleaning composition, cleaning method, and method for manufacturing semiconductor
US11441101B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 22, 2017 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | May 31, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning composition which can remove a layer of interest using a conventional apparatus, such as a coater, a baking furnace and a cleaning chamber, installed in semiconductor manufacturing equipment while preventing the damage or deformation of layers other than the layer of interest, such as a substrate and an interlayer insulation film; a cleaning method using the cleaning composition; and a method for producing a semiconductor employing the cleaning method. A layer of interest formed on a substrate is cleaned with a cleaning composition containing a component capable of decomposing the layer of interest and a film-forming polymer. An example of the layer of interest is a hard mask film. An example of the component is at least one of a basic compound and an acidic compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.