Micromechanical pressure sensor device and corresponding manufacturing method

US11441964B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Volkmar Senz · Metzingen, DE
• Arne Dannenberg · Metzingen, DE
• Jochen Franz · Reutlingen, DE

Key dates

• Filing date: Oct 26, 2018
• Grant date: Sep 13, 2022
• Expiry date: Jul 6, 2039

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/0264
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical pressure sensor device is equipped with a sensor substrate including a front side and a rear side. The device includes a pressure sensor unit suspended in the sensor substrate, a first cavity above the pressure sensor unit, which is exposed toward the front side via one or multiple access openings, one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity, and a circuit substrate, on which the rear side of the sensor substrate is bonded. A second cavity, which is in fluidic connection with the stress relief trenches, is formed below the pressure sensor unit in the circuit substrate. At least one channel is provided in a periphery of the pressure sensor unit, which is in fluidic connection with the second cavity and is exposed to the outside.