Semiconductor processing flow field control apparatus and method
US11443966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2020 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Jan 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02005
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems, apparatuses, and methods are provided for predicting or determining irregular processing parameters during processing of a semiconductor wafer in a semiconductor processing apparatus, such as an etching apparatus. A semiconductor processing apparatus includes a load port that is configured to receive a semiconductor wafer. A process chamber is coupled to the load port, and a fan is configured to selectively vary a flow of fluid in the process chamber. One or more sensors are provided in the process chamber and are configured to sense one or more processing parameters in the process chamber. A controller is coupled to the one or more sensors and to the fan, and the controller is configured to control the fan to vary the flow of fluid in the process chamber based on the sensed one or more processing parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.