Semiconductor device and manufacturing method thereof
US11444013B2 · kind B2 · utility
0Cited by
61References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2019 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Dec 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.