High power multilayer module having low inductance and fast switching for paralleling power devices
US11445630B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2021 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Jan 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10272
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.