Vapor chamber, heatsink device, and electronic device
US11445636B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 31, 2019 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Oct 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/427
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A vapor chamber that includes a housing including a first sheet and a second sheet opposing each other and joined together at outer edges of the first sheet and the second sheet and defining a hollow vapor flow pass therein; a working fluid in the housing; a first wick in contact with the vapor flow pass; and a second wick between the first wick and an inner wall surface of at least one of the first sheet and the second sheet. The first wick defines a first liquid flow pass, the second wick defines a second liquid flow pass, and a first average diameter of the first liquid flow pass is smaller than or equal to 75% of a second average diameter of the second liquid flow pass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.