Ryan John Lewis
9Patents
3h-index
13Co-inventors
46Inventor score
Filing activity: Sep 17, 2015 → Mar 7, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11598594B2 | Micropillar-enabled thermal ground plane | Electricity | 15 | Active |
| US9921004B2 | Polymer-based microfabricated thermal ground plane | Performing Operations; Transporting | 12 | Active |
| US11445636B2 | Vapor chamber, heatsink device, and electronic device | Electricity | 3 | Active |
| US10724804B2 | Method and device for spreading high heat fluxes in thermal ground planes | Mechanical Engineering; Lighting; Heating | 2 | Active |
| US11988453B2 | Thermal management planes | Electricity | 1 | Active |
| US10731925B2 | Micropillar-enabled thermal ground plane | Electricity | 1 | Active |
| US12104856B2 | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems | Performing Operations; Transporting | 1 | Active |
| US11930621B2 | Folding thermal ground plane | Electricity | 0 | Active |
| US12385697B2 | Micropillar-enabled thermal ground plane | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.