Methods of using surface treatment compositions
US11447642B2 · kind B2 · utility
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22References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 7, 2021 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Jun 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3105
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.