Patent · US Active

Layer forming method and apparatus

US11447864B2 · kind B2 · utility

1Cited by
2,211References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 6, 2020
Grant dateSep 20, 2022
Priority date
Expiry dateAug 3, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76877
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

There is provided a method and apparatus to deposit a molybdenum comprising layer on a substrate by supplying a precursor comprising molybdenum(VI) dichloride dioxide and a first reactant comprising boron and hydrogen to the substrate in a reaction chamber to react and form the molybdenum layer. The first reactant comprising boron and hydrogen may be diborane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.