Semiconductor package test apparatus
US11448694B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jun 29, 2020 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Jun 29, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0466
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.